TAIWAN UNION TECHNOLOGY CORPORATION

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 14102
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM11146
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 1092
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 969
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 7113
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6150
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 488
 
  
 
A61K PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES 2253
 
  
 
C07D HETEROCYCLIC COMPOUNDS 2160
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0260,365 RESIN COMPOSITION AND USES OF THE SAMEJun 06, 16Sep 14, 17[C08J, C08L, C08K, B32B]
2014/0255,711 RESIN COMPOSITION AND USES OF THE SAMEMar 15, 13Sep 11, 14[C08L]
2014/0072,807 RESIN COMPOSITIONS AND USES OF THE SAMENov 13, 12Mar 13, 14[C09D, C08L, C08K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9902136 Resin composition and uses of the sameMay 24, 12Feb 27, 18[C08G, C08L, B32B]
9718986 Epoxy resin blendJan 24, 14Aug 01, 17[C08J, C08G, C09D, D06M, C08L, H05K]
9708484 Resin composition and uses of the sameJun 26, 14Jul 18, 17[C08L, C08K]
9656443 Stable solution of ring-opened polymer and the use thereofJan 06, 12May 23, 17[C08G, B32B]
9657154 Resin composition and uses of the sameDec 24, 14May 23, 17[C08J, C08G, C09D, C08L, C08K, B32B]
9006377 Resin composition and uses of the sameJan 13, 12Apr 14, 15[C08J, C08G, C08L, B32B, C08K]
8912293 Resin composition, and prepeg and laminate prepared using the sameSep 22, 11Dec 16, 14[A61K, C08G, C07D, C08L, B32B, C08K, H05K]
8846790 Resin composition, and prepreg and printed circuit board prepared using the sameJul 26, 11Sep 30, 14[C09D, H05K]
8748513 Epoxy resin composition, and prepreg and printed circuit board using the sameJul 15, 10Jun 10, 14[C08L, B32B, C08K, H05K]
8734950 Resin composition and uses of the sameJun 15, 11May 27, 14[C08G, B32B]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0189,746 PREPREG AND USES OF THE SAMEAbandonedDec 26, 14Jul 02, 15[C08G, C08L, H05K, B32B]
2014/0039,094 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAMEAbandonedOct 11, 13Feb 06, 14[C08J]
2013/0306,357 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USNG THE SAMEAbandonedJul 26, 13Nov 21, 13[C09D, H05K]
2013/0143,046 EPOXY RESIN COMPOSITION, AND PREPREG AND METAL-CLAD LAMINATE USING THE SAMEAbandonedFeb 27, 12Jun 06, 13[B05D, C09D, C08L, B32B, C08K]
2012/0329,912 FUSED FILLER AND ITS MANUFACTURING METHOD AND USEAbandonedSep 08, 11Dec 27, 12[C04B, C08K, H05K]
2012/0097,437 Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the SameAbandonedJan 14, 11Apr 26, 12[C08L, H05K, C08K]
2012/0055,704 EPOXY RESIN BLENDAbandonedSep 06, 10Mar 08, 12[C01B, H05K, B32B]
2012/0024,580 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAMEAbandonedNov 01, 10Feb 02, 12[C08L, H05K]
2011/0284,276 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAMEAbandonedOct 19, 10Nov 24, 11[H05K, C08K]
2011/0253,434 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAMEAbandonedJul 15, 10Oct 20, 11[C08G, C08L, H05K]
2010/0255,740 EPOXY RESIN BLENDAbandonedJun 30, 09Oct 07, 10[C08G, C08L, B32B]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.